CRYSTAL PROCESSING SERVICE FOR R&D

Wiresaw

Crystal Slicing Service

SixPoint Materials, Inc. offers crystal slicing service using a multiple wire saw. We have an experience on slicing GaN bulk crystals. SixPoint's multiple wire saw is able to slice single crystals of GaN, AlN, SiC, sapphire, and glasses, quartz, ceramics, etc. The wire thickness is 0.17 mm and the slicing thickness is variable from 0.3~3 mm. The maximum diameter of an ingot is 2". Please contact us for price and specifications.

Grinder

Crystal Grinding Service

SixPoint Materials, Inc. offers crystal grinding service for your R&D needs. We are specialized in so-called hard-to-machine materials, such as GaN, sapphire, and SiC. We can handle matarials up to 4" diameter. Please contact us for price and specifications.

Grinder

GaN Lapping, Polishing, CMP Service

SixPoint Materials, Inc. offers lapping, polishing, CMP of GaN wafers your R&D needs. Please contact us for price and specifications.